Building the semiconductor technologies and engineering capabilities that power the next generation of AI computing.
Gladiator Micro connects advanced semiconductor technologies with companies developing next-generation chips. We work at the intersection of engineering execution, verification depth and silicon delivery — enabling design teams to adopt proven technology faster and with lower programme risk.
Headquarters — Singapore
Singapore sits at the centre of the Asian semiconductor supply chain — a stable, rules-based jurisdiction close to foundries, packaging partners and regional design centres, allowing us to serve customers across Asia within transparent commercial and legal frameworks.
We maintain working relationships across the semiconductor technology ecosystem — EDA providers, verification hardware suppliers, foundry and packaging interfaces and engineering partners worldwide.
Every engagement is led by engineering judgement. Our teams evaluate architecture trade-offs, interface requirements, verification strategy and implementation risk before commercial discussion.
Gladiator Micro is building capability with intent: from engineering services and design capability toward proprietary semiconductor technologies, compounding across multiple silicon generations.
From ASIC design and verification to advanced development platforms, Gladiator Micro combines semiconductor engineering capabilities with technologies that accelerate complex silicon development.
Engineering support across the semiconductor development lifecycle, from architecture to silicon.
Hardware-assisted verification and development solutions enabling faster silicon validation.
Engineering support for evaluating, integrating, and deploying semiconductor development technologies across design and validation workflows.
Engineering expertise across critical stages of modern ASIC development.
Micro-architecture definition and synthesizable implementation.
UVM environments, coverage closure and regression management.
Scan architecture, ATPG, compression and test coverage.
Synthesis, place and route, power and clock structures.
Multi-corner timing closure and signoff quality.
Signoff checks, foundry interface and release execution.
FPGA prototyping, hardware-assisted verification and system-level validation environments that de-risk silicon ahead of tape-out.
High-capacity prototypes for early software and system enablement.
Emulation-class throughput with full debug visibility.
Repeatable environments for RTL, firmware and driver work.
Full-stack scenarios executed against the complete design.
Use-case level validation ahead of first silicon.
Structured bring-up, characterisation and lab support.
Helping semiconductor teams evaluate, integrate, and deploy development technologies across complex design and validation workflows.
Our engineering engagement model covers each stage of the design flow, either as a full turnkey programme or as targeted support alongside your internal team.
Specification, micro-architecture and subsystem definition.
Synthesizable RTL implementation and integration.
UVM environments, coverage closure and regressions.
Scan insertion, ATPG and test coverage optimisation.
Floorplanning, place and route, timing and signoff.
Signoff checks, foundry interface and production release.
Engineering expertise aligned with the technologies shaping next-generation computing systems.
Compute-dense accelerators, memory bandwidth and scalable interconnect.
High-speed serial interfaces and networking silicon for data movement at scale.
Reliability, functional safety and long-lifecycle silicon programmes.
Chiplet architectures, memory subsystems and datacentre-class devices.
We collaborate with leading semiconductor technology, EDA, hardware, and engineering partners worldwide.
Short notes from our engineering team on the technical realities shaping semiconductor programmes today.
As designs scale, regression capacity and debug visibility — not RTL authoring — determine tape-out dates. Planning verification infrastructure early is the highest-leverage decision in most programmes.
Memory bandwidth, die-to-die links and on-chip interconnect increasingly set the performance ceiling of accelerator silicon, shifting engineering effort toward interface and integration work.
Proximity to foundry and packaging partners, combined with a stable legal framework, makes Singapore a practical base for coordinating multi-region semiconductor development.
Singapore-based, serving fabless semiconductor companies, technology partners, investors and engineering teams worldwide.
Provide a short description of your programme and we will route your enquiry to the appropriate team.